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How to selectively delete advanced degassing holes in Silicon Layout option
Here are the steps to selectively delete a few degassing holes/voids in the design:1. This option is only available with Silicon Layout Option as shown below:2. Change to the shape application mode...
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Protect Differential Pair Reference Planes During Shape Degassing
Copper shape degassing is commonly used to improve manufacturability, but when voids are generated beneath high-speed differential pairs on adjacent layers, they can unintentionally disrupt return...
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How to import a die component from DEF?
Cadence IC Package design tools support many formats for importing a die component for placement into your package substrate layout. For standard die components, this includes the Cadence OpenAccess...
View ArticleWhy do symmetrical etch layers show different impedance values in Display >...
Hi everyone,I routed clines on L4 and L5 with the same width, and both layers are symmetrical to the shield ground.However, in Display > Parasitic, I’m seeing different impedance values. I expected...
View ArticleAutorouter Help in APD 24.1
Hello,I wanted to ask how someone could auto route or begin the process of auto bonding (I don't know if auto bonding is the same as a traditional auto route) a common bond pad line on some y axis to...
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How to generate IC style via cut arrays in GDS output?
As designs get more involved in WLP designs, there is a need to create IC style via cut arrays in Packaging tools.I have created IC style via cut arrays in Allegro X Advanced Package Designer. How do I...
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How to find out a misaligned via from a via stack
I am performing a package design with many blind / buried vias. The blind / buried vias of adjacent layers are stacked only if via centers are aligned. Is there a way to find out the misaligned vias?...
View ArticleConnecting to APD from external process to execute skill code
Im looking for a way to connect to an existing/active APD session from an external process and executing skill within that APD session. The idea is to create this communication link between our custom...
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How to import large pin count devices to Allegro X APD?
Allegro X Advacned Package Designer offers an extremely rich environment for supporting and manipulating data from text files, GDSII, some 3rd part EDA vendors and Microsoft Excel spreadsheets in xml...
View ArticleElectrical Net Classes Import Using technology file (.dcfx, .tcfx)
I'm trying to import The net classes in APD from a technology file with extension (.dcfx and also tried with .tcfx) The spacing and Physical Netclasses are being imported but not Electrical Net...
View ArticleFAQ about Net resistance in APD+ and Allegro
Here are some frequently asked questions regarding Net Resistance in Allegro PCB Editor and Advanced Package Designer:What does the net resistance include? Net resistance includes traces, shapes, and...
View ArticleWhile opening *.mcm file in APD 2023
While opening files in APD, getting error SPMHOD-29.. which read unable to open design. design compatibility log says "This design was last saved with: apd 24.1 P001 - 9/4/2024".. How fixed this...
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How to create soldermask at pins in APD+ and set up soldermask-to-soldermask...
When I try to create a soldermask for pins of BGA or DIE pad using the Create Bond Finger Soldermask command, I cannot choose the Pins object in Find Filter. I can choose only Finger and Vias. How can...
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Display Bump Pin Numbers APD 2023
Hi,I would like to display the bump pin number,Below is an example with and without the pin number showing on the same file:I've tried a lot to things but nothing seems to work.Thanks,ShaiP.S. the one...
View ArticleExploring Advanced Packaging: 2.5D vs. 3D
Exploring Advanced Packaging: 2.5D vs. 3DThe semiconductor industry is undergoing a transformation with 2.5D and 3D packaging technologies—but what sets them apart, and why should engineers care? Dive...
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How to export the updated die pin information during die text-out
I used group edit to replace a few padstacks (NEW_DIE_PAD) of the die pin with the NEW_DIE_PAD_1 padstack. However, all die padstacks exported during die text-out remain NEW_DIE_PAD, even though die...
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Export as STEP
I am using Allegro X APD 24.1. I want to export the design as a STEP file, including all layers, dielectrics and vias. I found that should be possible but I don't see the option:
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IC Packagers: Optimizing the connectivity between die escape routing and BGA...
Package designers need to add escape routes to a die to facilitate further package routing: these routes provide essential pathways for signals to exit the die and reach other parts of the package or...
View ArticleCannot see NPTs in my PCB
How do I enable showing NPTs?I have enabled in "Color dialog" both `Ncdrill_Figure` and `Ncdrill_Legend`, holes still invisible.
View Article`.psm` files missing for placement
I am using Cadence Allegro X APD. In my computer I have the two files- `/path/to/somewhere/component.psm`- `/path/to/somewhere/deleteme.psm`When I go to "Place manual" and select "Advanced...
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