Have you heard that starting SPB 23.1, Allegro Package Designer Plus (APD+) will be renamed as Allegro X Advanced Package Designer (Allegro X APD)?
Allegro X APD offers multiple new features and enhancements on topics like Via Structures, Wirebond, Etchback, Text Wizards, 3D Canvas, and more.
This post presents the new 3DX Canvas introduced in SPB 23.1. This can be invoked from Allegro X APD (from the menu item View > 3DX Canvas).
Some of the key benefits of the new canvas:
- This canvas addresses the scale and complexity in large modern package designs. It provides highly efficient visual representation and implementation of packages.
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- The new architecture enables high-performance 3D incremental updates by utilizing GPU for fast rendering.
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- Real-time 3D incremental updates are supported, which means that the 3D view is in sync with all changes to the database.
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- The new canvas provides 3D visualization support for packaging objects such as wire bonds, ball, die bump/pillar geometries, die stacks, etch back, and plating bar.
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- This release also introduces the interactive measurement tool for a 3D view of packages. Once you open 3DX Canvas, press the Alt key and you can select the objects you want to measure.
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- 3DX Canvas provides new 3D DRC Bond Wire Clearances with Real 3D DRC Checks. True 3D DRC in Constraint Manager has been introduced. If you open Constraint Manager, there will be a new worksheet added. Following DRC checks are supported:
Wire to Wire
Wire to Finger
Wire to Shape
Wire to Cline
Wire to Component![]()
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