hello, help me!
There are many change in the bump design. I want to design bump by APD.
The bump(die) is a stagger , create it by die generator.
Because,the pin is not isometric. In order to RDL routing, so the bump is not isometric.
I move the symbol pin in APD symbol edit(as show in the picture), and selected symbol RBM write device file, write library symbol.
Export the bga text( bga text out) ,But the bump is not modified, the bump is still stagger.
Can you help me!
pitch2> pitch1
thanks