Hi,
There are mang components in BGA ball side of flipchip package.
Are there DFA check space of compont body or pin soldermask to BGA ball or BGA PAD or bga soldermask in allegro APD?
I only find space of compont to compont in APD DFA.
Hi,
There are mang components in BGA ball side of flipchip package.
Are there DFA check space of compont body or pin soldermask to BGA ball or BGA PAD or bga soldermask in allegro APD?
I only find space of compont to compont in APD DFA.