Re-size and Re-space of differenetial pairs
i'm try to change the width and gap of differenetial pairs, but it only works on the width of line. i can't respace the DP. how can I use this fucation to change the gap of DP? Thanks!
View ArticleWhere i can find sample IC package design file ?
Hi Team,I am new in IC package design. I need sample design for IC package . is any one let me know where i can get . Sample design in C Drive path ?
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Varying height properties for single footprint
Version: Orcad 17.4Licenses: Capture & CIS, EDM, CIP, PCB Editor professionalWe currnetly use CIP to manage part information with EDM managed projects, symbols and footprints.Most of the time we...
View Articlehow to convert .pcb format file to .mcm for apd+ v22
How do i import a xpedition layout .pcb file to cadence apd+
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How to check same net spacing for microvias
I tried using the Check Same Net Spacing: Micovia To Microvia method. However, it generated too many errors that I couldn't distinguish between "OK" and "Not Good," as example picture. Has anyone...
View ArticleAPD+ 22.1 on Linux Environment Abnormal Display
My company is using APD+ on a Linux platform and I have encountered some display concerns as the following:1. Whenever I hover my mouse over a via, it abnormally zooms in (my screen becomes the color...
View ArticleExtracting Parasitic RLC on Cadence APD+
HiJust want to have your comment or maybe help me understand if the Cadence APD+ can extract accurately the parasitic RLC of the layout? And if yes, what parameters or settings should be observed...
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Vias are gone in 3D Cavas
All vias are not displayed in 3D canvas whereas they are shown in 3D. The design layout is made by Allegro Package Designer+.This is 4-layer(1-2-1) design, and each padstack is defined as "micro-via"...
View ArticleDoes anyone know how to connect two pins of a die to the same net so they are...
I'm trying to create a specific use case that has a die component with both topside and backside connections. The catch is that these connections need to be considered an electrical short. When I...
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Allegro X APD: SPB 23.1 release —Your freedom to design boldly!
Cadence is super excited to announce SPB 23.1 release —Your freedom to design boldly! These tools help engineers build better PCBs faster with the new 3D engine and optimized interface. We have been...
View ArticleRelative delay analysis is impacted by pbar
Does anyone know how to not include a pbar in a constraint manager analysis? I have some relative delay constraints applied on a group of differential nets. When I analyze the design these all show an...
View ArticleMultiple touch points for bond wires on a die pin
Does anyone know whether it is possible to have multiple contact points for a bond wire on a large die pad? Note: This is different from adding multiple wires which I will also be doing. I need to add...
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Aligning Components using Offset Mode in Allegro X APD
Starting SPB 23.1, in Allegro X PCB Editor and Allegro X Advanced Package Designer, you can align components by using offset mode. Earlier only spacing mode was available.Follow these steps to Align...
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What is Allegro X Advanced Package Designer and why do I not see Allegro...
Starting SPB 23.1, Allegro Package Designer Plus (APD+) has been rebranded as Allegro X Advanced Package Designer (Allegro X APD).The splash screen for Allegro X APD will appear as shown below, instead...
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Introducing new 3DX Canvas in Allegro X Advanced Package Designer
Have you heard that starting SPB 23.1, Allegro Package Designer Plus (APD+) will be renamed as Allegro X Advanced Package Designer (Allegro X APD)? Allegro X APD offers multiple new features and...
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How to reuse device files for existing components
Have you ever encountered ERROR(SPMHNI-67) while importing logic? If yes, you might already know that you had to export libraries of the design and make sure that paths (devpath, padpath, and psmpath)...
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How to allow DRCs to the surrounding objects using Etch Back option
Starting from SPB23.1, a new option, Allow DRCs to surrounding metal, has been added in the Etch-Back form to allow DRCs to the surrounding objects. form to allow DRCs to the surrounding objects.The...
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How to add wirebond profile to a die pin?
Starting SPB23.1, a new pin property,WIREBOND_PROFILE_NAME is introduced. This property can be used to define a wirebondprofile to a die pin. When adding a wirebond, the pin will use the profile...
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How to access the Transmission Line Calculator in Allegro X APD
Have you ever thought of a handy utility to specify all necessary transmission line parameters to decide upon the stackup? Starting SPB 23.1, a handy feature Transmission Line Calculator,is built...
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How to export and import symbols and component properties through Die Text...
Starting SPB 23.1, Allegro X APD lets you import/export the symbol and component properties by using Die Text-In/Out wizards. Exporting the symbol You can export the symbol by using File > Export...
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