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What is Allegro X Advanced Package Designer and why do I not see Allegro...
Starting SPB 23.1, Allegro Package Designer Plus (APD+) has been rebranded as Allegro X Advanced Package Designer (Allegro X APD).The splash screen for Allegro X APD will appear as shown below, instead...
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Introducing new 3DX Canvas in Allegro X Advanced Package Designer
Have you heard that starting SPB 23.1, Allegro Package Designer Plus (APD+) will be renamed as Allegro X Advanced Package Designer (Allegro X APD)? Allegro X APD offers multiple new features and...
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How to reuse device files for existing components
Have you ever encountered ERROR(SPMHNI-67) while importing logic? If yes, you might already know that you had to export libraries of the design and make sure that paths (devpath, padpath, and psmpath)...
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How to allow DRCs to the surrounding objects using Etch Back option
Starting from SPB23.1, a new option, Allow DRCs to surrounding metal, has been added in the Etch-Back form to allow DRCs to the surrounding objects. form to allow DRCs to the surrounding objects.The...
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How to add wirebond profile to a die pin?
Starting SPB23.1, a new pin property,WIREBOND_PROFILE_NAME is introduced. This property can be used to define a wirebondprofile to a die pin. When adding a wirebond, the pin will use the profile...
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How to access the Transmission Line Calculator in Allegro X APD
Have you ever thought of a handy utility to specify all necessary transmission line parameters to decide upon the stackup? Starting SPB 23.1, a handy feature Transmission Line Calculator,is built...
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How to export and import symbols and component properties through Die Text...
Starting SPB 23.1, Allegro X APD lets you import/export the symbol and component properties by using Die Text-In/Out wizards. Exporting the symbol You can export the symbol by using File > Export...
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Skill to delete selected net and padstakck via
Hi，I want to delete via use skill，but i dont write this skill. can you help me.This skill has Interactive interface，the interface can imput Select Net and select padstack；I can use temp group to...
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Allegro: Tip of the Week : Push Connectivity
At times, there might arise a condition in the design where you need to push the net of selected pins to all its physically connected objects. For example, a few pins are updated with a new net, and it...
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modify bump and export the modified bump
hello, help me!There are many change in the bump design. I want to design bump by APD.The bump(die) is a stagger , create it by die generator. Because，the pin is not isometric. In order to RDL routing,...
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Find Routing problem (Route Vision) and quickly to fix these problems
The vision manager is good tool for routing check. but no quickly or effective tool to fix or optimize this problems to be optimized.For example, parallel Gap less than preferred, min seg/Arc...
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DFA check space of compont to BGA ball or BGA PAD in APD
Hi，There are mang components in BGA ball side of flipchip package.Are there DFA check space of compont body or pin soldermask to BGA ball or BGA PAD or bga soldermask in allegro APD?I only find space...
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How to avoid adding degassing holes to a particular shape
In a package design, designers often need to perform degassing. This is typically done at the end of the design process before sending the design to the manufacturer.Degassing is a process where you...
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Allegro X APD - Tip of the week: Wondering how to set two adjacent layers as...
By default, a dielectric must separate each pair of conductor layers in the cross-section of a design. In rare cases, this does not represent the real, manufactured substrate.If your design requires...
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slide hug only is wrong?
Hi，Can you tell me which setting is causing this?In the general edit. I try slide via to other position. but the slide is wrong.in the cm，i set pad-pad connect is all allowed，and i turn off via to pad...
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Creating Power and Ground rings in Allegro X Package Designer Plus
Power and Ground rings are exposed rings of metal surrounding a die that supply power/ground to the die and create a low-impedance path for the current flow. These rings ensure stable power...
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Allegro X APD : Tip of the Week: ‘Auto-blank other rats’ feature
When working on a complex design, it is common to have very many net ratlines. Quantities like 1000 ratlines are possible. It can result in a cluttered view while routing. Therefore, it is useful to...
View ArticleHow to execute APD+ embedded function in my form?
Hello, SKILL experts. I'm studying SKILL language to build some useful function in APD+.Now, I want to execute 'Import Sub-drawing' function in new form.But I cannot find how to do execute APD+...
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Package Design Integrity Checks
When things go wrong with your package design flow, it can sometimes be difficult to understand the cause of the issue. This can be something like a die component is wrongly identified as a BGA, a via...
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Database Maintenance: DBDoctor
The DBDoctor application checks the database for errors and other problems, and presents a report about them. DBDoctor supports .brd, .mcm, .mdd, .psm, .dra, .pad, .sav, and .scf databases.DBDoctor...
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How to transfer etch/conductor delays from Allegro Package Designer (APD) to...
The packaging group has finished their design in Allegro Package Designer (APD) and I want to use the etch/conductor delay information from the mcm file in the board design in Allegro PCB Designer. Is...
View ArticleHow to make a 3D step copper-filled via on Cadence APD?
I am currently working on a project the requires a 3D step file to perform some electrical simulations. However, when I generate the 3D step file using Cadence APD, the via has no filling/plugging...
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How to delete a Die without removing it from a design entirely
When deleting a symbol in APD, the user receives the following warning message:Deleting Die or BGA instances will result in the deletion of the parent component along with any associated logical...
View ArticleErrors in 3D canvas when Via size is less than 100um
I'm using Allegro X APD + 23.1 to create a chiplet package for EM simulation models. I noticed that when the finish size of the drill hole, or the plating size of any layer, is smaller than 100um, they...
View ArticleODB++ Output places components on wrong side
APD designs with flip chip dies on the top and bottom of the board are coming in wrong. Siemens only goes off the 'mirrored' property to determine whether components go on the top or bottom view. So I...
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