APD designs with flip chip dies on the top and bottom of the board are coming in wrong. Siemens only goes off the 'mirrored' property to determine whether components go on the top or bottom view. So I have all my components showing on the top because my backside flip chip is 'not mirrored'. Also my package outline footprint is on the top because it was designed not mirrored. If I have topside flip chip dies, they stay on top because they are 'mirrored geometry'. Anyone else have a workaround for this issue? Siemens says it's 'not a bug' and that the 'have always done it this way', but I find it hard to believe that no one else has this issue. Flip chip dies must be designed bumps up and the tool will mirror the geometry for topside mounting and just not mirror it for backside placement.
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