For N number of pins of a die and M number of pads on the package available, a pin can be connected to a pad in many different ways. Is there a tool or an algorithm that traverses and make the connections in the best possible ways with minimum conflicts and the need to jump back and forth between layers to make the connections? What if I am in the capacity to wiggle the positions of the pads in the BGA (for example) to move some of the pads around to make the routing efficient? Help appreciated!
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